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Material Overview
What is PI?
PI material — polyimide — represents the peak of thermoplastic performance for continuous high-temperature service. Unlike most engineering thermoplastics, polyimide does not melt when heated; instead, it maintains structural integrity far beyond the service limits of any other commercial polymer. Ready Plastics PI is an imidized thermoplastic available in rod and plate for precision-machined components in the most demanding environments.
PI plastic delivers outstanding thermal stability, maintaining mechanical integrity at temperatures far exceeding those of PAI, PEEK, or any other melt-processable engineering thermoplastic. It offers excellent wear resistance, very low outgassing (critical for vacuum and semiconductor applications), and strong dielectric properties that remain stable across wide temperature ranges. The material also exhibits low creep and excellent dimensional stability under sustained load at high temperature.
Typical applications include semiconductor wafer carrier rings, aerospace structural inserts, electrical bushings for high-temperature equipment, thrust washers for turbo machinery, and any component where heat alone would destroy a lower-performing polymer. PI is the material of choice when no compromise on thermal or mechanical performance is acceptable and when the operating environment falls outside the capability of PAI.
For applications requiring sliding contact or bearing loads at high temperature, consider PAI AF — anti-friction polyamide-imide, which offers internal lubrication for wear applications. Contact Ready Plastics for available PI dimensions and to request a quote.
Frequently Asked Questions
PI, answered
What is PI material?
PI (polyimide) is an ultra-high-performance thermoplastic that maintains structural integrity at temperatures higher than any other commercial engineering polymer. Ready Plastics PI is available as imidized rod and plate for precision-machined components in aerospace, semiconductor, and extreme industrial applications requiring maximum thermal and mechanical performance.
How does PI compare to PAI?
PI operates at higher temperatures than PAI and offers lower outgassing — important for vacuum environments. PAI generally has higher tensile strength at moderate temperatures and is available in more form factors at lower cost. Choose PI when the application temperature exceeds the limits of PAI or when low outgassing in vacuum environments is essential.
Why is PI used in semiconductor applications?
PI combines very low outgassing, excellent dimensional stability, strong electrical insulation, and thermal stability well above the temperatures used in wafer processing. These properties make it ideal for wafer carrier rings, test sockets, and handling fixtures where contamination and dimensional drift cannot be tolerated.
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